USG Corporation introduces the industry’s first lightweight and sustainable 5/8-inch Type X gypsum wallboard with moisture- and mold-resistant properties: USG Sheetrock Brand EcoSmart Panels Mold Tough Firecode X.
USG Sheetrock Brand EcoSmart Panels Mold Tough Firecode X are manufactured with a reduced carbon footprint and lower water usage. The panels, developed to meet the demand for more sustainable building materials, feature USG’s proprietary lightweight gypsum core technology that contractors prefer, and are the only 5/8-inch Type X moisture- and mold-resistant panels to meet the Architecture 2030 Challenge for Products.
“Providing solutions to the industry’s biggest challenges has been the driving force behind USG’s success for the last 115 years,” said Brian Tauke, general manager, Wallboard at USG Corporation. “We have expanded the Sheetrock EcoSmart Panels line which enables sustainable construction to take a major step forward in helping architects meet the goals set forth in the Architecture 2030 Challenge through sustainable products.”
USG committed to creating a wallboard with a reduced impact on natural resources and the environment when it launched the Sheetrock Brand EcoSmart portfolio earlier this year. Through new gypsum core chemistries and manufacturing processes, USG Sheetrock Brand EcoSmart Panels Mold Tough Firecode X use up to 15 percent less water and have up to 11 percent less global warming potential. These panels also reduce transportation fossil fuel consumption because they are lighter weight.
Beyond environmental benefits, USG Sheetrock Brand EcoSmart Panels Mold Tough Firecode X:
For more information about USG Sheetrock Brand EcoSmart Panels Mold Tough Firecode X and other innovative products, visit www.usg.com.